High density printed wiring board

Details High density printed wiring board High density printed wiring board

H - Electricity

05

K

356/18

H05K 1/02 (2006.01) H05K 3/06 (2006.01) H05K 3/10 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 3/00 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1203635

ABSTRACT Feed through vias (38) of 8 mil and smaller diameter are placed on 25 mil centers or smaller so that the feed-through vias serve only as electrical connections and do not block channels between conductors (24a and 42a). The method for forming such feed-through vias and interconnections utilizes metallic resist (36 and 40) which covers the feed-through vias so that the metallic resist, along with conventional photoresist material, prevent undesired etching of the feed-through vias even in the event of misregistration of the photo- resist material.

427474

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