Control of electroless plating baths

Details Control of electroless plating baths Control of electroless plating baths

C - Chemistry, Metallurgy

23

C

117/77

C23C 18/16 (2006.01) G01N 27/42 (2006.01)

Patent

CA 1265710

ABSTRACT There is disclosed a method for analyzing an electroless plating solution which comprises metallic ions and reducing agent for the metallic ion, the method comprising providing at least two electrodes in the plating solution, electrochemically analyzing at least one constituent of the plating solution using the electrodes, and providing a reproducible surface on at least one of the electrodes after the analysis by electrochemically stripping and resurfacing in the plating solution in order to prepare for the next analysis cycle.

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