Room temperature setting adhesive composition

Details Room temperature setting adhesive composition Room temperature setting adhesive composition

C - Chemistry, Metallurgy

08

L

400/4222, 400/42

C08L 31/04 (2006.01) C08L 29/04 (2006.01) C09J 3/14 (1985.01)

Patent

CA 1261503

ABSTRACT OF THE DISCLOSURE A room temperature setting adhesive composition capable of giving high initial bond strength as well as cured bonds having good resistance to water and boiling contains, as main components thereof, (A) an emulsion containing an acetoacetylated polyvinyl alco- hol and a vinyl acetate copolymer produced by copolym- erizing an acetoacetylated, ethylenically unsaturated monomer and another ethylenically unsaturated monomer and (B) a resorcinol resin precondensate and, as a curing agent, (C) hexamethylenetetramine.

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