Polyphenylene ether resin compositions containing...

Details Polyphenylene ether resin compositions containing... Polyphenylene ether resin compositions containing...

C - Chemistry, Metallurgy

08

L

400/3040, 400/48

C08L 25/04 (2006.01) C08L 51/04 (2006.01) C08L 71/04 (1985.01)

Patent

CA 1220591

8CN-3565 POLYPHENYLENE ETHER RESIN COMPOSITIONS CONTAINING POLY (4-METHYLSTYRENE) ABSTRACT OF THE DISCLOSURE Novel molding compositions are disclosed which comprise a poly(2,6-dimethyl-1,4-phenylene) ether resin or copolymers of this resin and minor amounts of other phenols and a poly(4-methylstyrene) or a rubber modified poly(4-methylstyrene). Also included in the disclosure are methods for preparing the novel composit- ions, as well as methods for molding the compositions, and the molded products. The products exhibit increased heat distortion temperatures (HDT) in many compositions, melt flow, and resistance to stress cracking, when compared with blends of polyphenylene ether resins and polystyrene. Furthermore, the poly(4-methylstyrene) and the rubber modified poly(4-methylstyrene) have been found to be compatible with polyphenylene ether resins in all proportions.

410707

Affiliated with

Also associated with

Rating

Polyphenylene ether resin compositions containing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polyphenylene ether resin compositions containing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyphenylene ether resin compositions containing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1326357