H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/113
H01L 23/34 (2006.01) H01L 23/433 (2006.01) H01L 23/473 (2006.01)
Patent
CA 1290078
ABSTRACT A cooling structure for cooling heat generating elec- tronic components mounted on a substrate is disclosed. It includes a cold plate fixed on the substrate which is provided with first through holes opposed to the upper surfaces of the heat generating electronic components. Flow paths are formed inside the cold plate for circulating a coolant. An inlet is provided on a side of the cold plate for supplying the coolant to the flow paths. An outlet is provided on a side of the cold plate for exhausting the coolant from the flow paths. Pistons are inserted and held inside the through holes so that the lower surfaces of the pistons come into contact with the upper surfaces of the heat generating electronic components.
572835
Mine Shinji
Shimonishi Terumi
Corporation Nec
Smart & Biggar
LandOfFree
Cooling structure for heat generating electronic components... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cooling structure for heat generating electronic components..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling structure for heat generating electronic components... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1327142