Resin composition and a process for preparing laminates...

Details Resin composition and a process for preparing laminates... Resin composition and a process for preparing laminates...

C - Chemistry, Metallurgy

08

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154/102, 154/41,

C08L 63/00 (2006.01) C08G 14/08 (2006.01) C08G 59/24 (2006.01) C08G 59/62 (2006.01) C08G 59/68 (2006.01) H01B 3/40 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1292824

ABSTRACT An epoxy resin composition having exceptional stability which is useful in the preparation of elec- trical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25°C of less than 2.5 or an ester or anhydride of such acid. The epoxy resin composition can also con- tain a bishenol or bisphenol derivative such as bis- phenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the compo- sition prior to its use as in the preparation of elec- trical laminates.

514920

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