Soldering apparatus for printed circuit boards

Details Soldering apparatus for printed circuit boards Soldering apparatus for printed circuit boards

H - Electricity

05

K

26/127, 32/74

H05K 3/34 (2006.01) B23K 1/008 (2006.01) B23K 1/08 (2006.01)

Patent

CA 1319009

ABSTRACT The soldering arrangement has a lengthwise extending tunnel arrangement (1) with a soldering tunnel (3) through which a conveyor arrangement (10) for the work pieces extends. A soldering tunnel (3) which is inclined upwardly in the convey- ing direction is provided with a floor opening which is sur- rounded by a downwardly protruding sealing skirt (18) which is immersed in the molten liquid solder material (20) in a tub (19) below the soldering tunnel (3). The soldering nozzles (24) and (25) arranged within the soldering tunnel (3) are supplied through riser channels within the sealing skirt (18). A protective gas conduit (41) for supplying nitrogen opens into the soldering tunnel (3). The soldering tunnel (3) together with the conveyor path of the conveyor arrangement (10) extending within the soldering tunnel (3), is tiltable about a horizontal crosswise axis (47), whereby the inclination of the soldering tunnel (3) is adjustable. (Fig. 1)

594785

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