Semiconductor package

Details Semiconductor package Semiconductor package

H - Electricity

01

L

356/146

H01L 23/495 (2006.01)

Patent

CA 1300761

ABSTRACT OF THE INVENTION SEMICONDUCTOR PACKAGE In an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire.

613496

Affiliated with

Also associated with

Rating

Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1333387