Curable composition

C - Chemistry – Metallurgy – 08 – K

Patent

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Details

400/2005, 402/9

C08K 5/52 (2006.01) C08K 5/00 (2006.01) C08K 5/521 (2006.01) C08L 43/04 (2006.01)

Patent

CA 1232395

ABSTRACT OF THE DICSLOSURE A curable composition comprising an organic polymer containing at least one silicon-containing hydrolyzable group in the polymer molecule, an acid phosphoric acid compound and an organozirconium compound. The curable composition can be rapidly cured and has an improved pot life both in open system and in closed system.

495843

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