C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/2005, 402/9
C08K 5/52 (2006.01) C08K 5/00 (2006.01) C08K 5/521 (2006.01) C08L 43/04 (2006.01)
Patent
CA 1232395
ABSTRACT OF THE DICSLOSURE A curable composition comprising an organic polymer containing at least one silicon-containing hydrolyzable group in the polymer molecule, an acid phosphoric acid compound and an organozirconium compound. The curable composition can be rapidly cured and has an improved pot life both in open system and in closed system.
495843
Kawamura Joe
Wakabayashi Hiroshi
E. I. Du Pont de Nemours And Company
Osler Hoskin & Harcourt Llp
LandOfFree
Curable composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Curable composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1334066