Indirect cooling of electronic circuits

Details Indirect cooling of electronic circuits Indirect cooling of electronic circuits

H - Electricity

01

L

356/3

H01L 23/46 (2006.01) H05K 1/02 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1206622

INDIRECT COOLING OF ELECTRONIC CIRCUITS ABSTRACT OF THE DISCLOSURE This invention provides for the dissipation of heat generated in integrated circuit components (10,30) mounted on printed circuit boards (12). High conduction, low thermal resistance cooling channels (20,40) are mounted between the ICs (10,30) and the PC board (12) to effect conduction cooling in conjunction with forced air convection cooling of the ICs without adding substantially to the volume space requirements of the IC component-PC board assemblies.

449857

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