B - Operations – Transporting – 27 – B
Patent
B - Operations, Transporting
27
B
144/50
B27B 1/00 (2006.01) B27B 5/34 (2006.01) B27B 33/20 (2006.01) B27C 1/00 (2006.01) B27C 5/00 (2006.01) B27C 7/00 (2006.01) B27C 9/00 (2006.01) B27L 11/00 (2006.01)
Patent
CA 1277574
ABSTRACT OF THE DISCLOSURE In a method for profile chipping, the necessary chipping out of wany-edged corners laterally defining a side board to be separated is carried out in such a manner that firstly in a direction perpendicular to the trunk axis saw incisions are made to the full depth of the corner but that material ad- jacent the saw incision is simultaneously chipped out by chipping blades only to a lesser depth, and in a second working step in a second direction perpendicular to the first direction remaining corner material is chipped out by means of chipping blades and simultaneously a second saw incision is made. The side board exposed in this manner is separated by a saw severance cut. This provides throughout corner faces worked by saw cut which do not have any material splits due to chipping blades.
530690
Fetherstonhaugh & Co.
Gebruder Linck Maschinenfabrik "gatterlinck" Gmbh & Co. Kg
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