C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/114, 154/96
C08K 5/10 (2006.01) B27D 1/04 (2006.01) B32B 21/14 (2006.01) C08K 5/109 (2006.01) C08K 5/156 (2006.01) C08L 61/06 (2006.01)
Patent
CA 2008814
- 10 - O.Z. 0050/40567 Abstract of the Disclosure: A curing agent mixture for curing alkaline phenol/formaldehyde resins contains A) a pulverulent or fibrous filler and B) a carbonic eqter.
Dormeyer Dieter
Kochersperger Winfried
Pfuetze Eberhard
Wolf Franz
Basf Aktiengesellschaft
Dormeyer Dieter
Kochersperger Winfried
Pfuetze Eberhard
Robic Robic & Associes/associates
LandOfFree
Curing agent mixture for curing alkaline phenol/formaldehyde... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Curing agent mixture for curing alkaline phenol/formaldehyde..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curing agent mixture for curing alkaline phenol/formaldehyde... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1342639