Process for applying a metallic adhesion layer for ceramic...

C - Chemistry – Metallurgy – 23 – C

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C23C 4/02 (2006.01) C23C 4/04 (2006.01)

Patent

CA 2188614

In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings (6) to metallic components (1), the surface which is to be coated being cleaned in a first process step, so that the metallic surface is free of grease and oxide, a binder (3) is applied to the metallic surface of the base material (2) in a second process step. Metallic adhesive powder (4) is applied uniformly to the binder (3) in a third process step and solder powder (5), which has a smaller particle size than the adhesive powder (4), is applied uniformly to the binder (3) in a fourth process step. After drying the binder (3), a heat treatment is carried out for the purpose of soldering. The adhesion layers produced in this way are rough and provide a considerable positive lock for the ceramic thermal barrier coatings (6) which are to be sprayed thereon.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Process for applying a metallic adhesion layer for ceramic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for applying a metallic adhesion layer for ceramic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for applying a metallic adhesion layer for ceramic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1346093

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.