Porous para-oriented aromatic polyamide film, prepreg...

Details Porous para-oriented aromatic polyamide film, prepreg... Porous para-oriented aromatic polyamide film, prepreg...

C - Chemistry, Metallurgy

08

J

C08J 5/18 (2006.01) B32B 27/34 (2006.01) C08J 5/24 (2006.01) C08L 77/08 (2006.01) C08L 77/10 (2006.01) H05K 1/03 (2006.01) C08L 67/03 (2006.01) C08L 79/06 (2006.01) C08L 79/08 (2006.01)

Patent

CA 2379454

Provided is a porous para-oriented aromatic polyamide film which contains fine particles composed of a heat-resistant resin in an amount of 10 to 400 parts by weight based on 100 parts by weight of a pare-oriented aromatic polyamide and has a linear thermal expansion coefficient at 200 to 300°C of from -50×10 -6/°C. to +50×10 -6/°C. The porous para- oriented aromatic polyamide film shows excellent tear propagation resistance and has light weight and low linear thermal expansion coefficient, and is suitable as a prepreg material used for a base substrate for printed circuit board.

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