C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4008, 400/50
C08L 63/00 (2006.01) B23K 35/22 (2006.01) C09D 5/00 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01)
Patent
CA 1157181
ABSTRACT OF THE DISCLOSURE A resinous protective coating useful in adhering plastics to metallic substrates. The protective coating is particularly useful as a solder mask and in the manufacture of printed circuit boards with circuit patterns having a resolution of at least 0.25 mm lines and spaces thereon. The protective coating comprises resins dissolved in solvents, wherein the coating, upon being subjected to heat, goes from a high viscosity liquid to a gel and then to a solid phase, or from a soft "gel-like" state in to a solid or from a liquid or soft "gel-like" state into a solid phase without bleeding. The protective coating is resistant to copper, nickel and gold electroplating baths, adheres to insulating substrates, ad- hesive coated base materials as well as metallic substrates and is capable of withstanding the thermal shock of dip soldering.
343489
Kollmorgen Technologies Corporation
Macrae & Co.
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