Adhesives with thermal conductivity enhanced by mixed silver...

C - Chemistry – Metallurgy – 09 – J

Patent

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C09J 201/00 (2006.01) C09J 9/02 (2006.01)

Patent

CA 2696985

A thermally conductive adhesive comprises a mixture of at least two types of silver particles including a first type having a surface area to mass ratio in the range of 0.59 m 2/g to 2.19 m 2/g 3 and a tap density in the range of 3.2 to 6.9 g/cm and a second type having a surface area to mass ratio of 0.04 to 0.17 m 2/g and a tap density in the range of about 4.7 to 8.2 g/cm 3. According to certain embodiments of the invention the first type of silver particles includes oblong silver particles. The thermally conductive adhesive further comprises a binder, and optionally a solvent.

L'invention concerne un adhésif thermiquement conducteur comprenant un mélange d'au moins deux types de particules d'argent comprenant un premier type ayant un rapport surface spécifique sur masse dans la plage de 0,59 m2/g à 2,19 m2/g et une densité après tassement dans la plage de 3,2 à 6,9 g/cm3, et un deuxième type ayant un rapport surface spécifique sur masse de 0,04 à 0,17 m2/g et une densité après tassement d'environ 4,7 à 8,2 g/cm3. Selon certains modes de réalisation de l'invention, le premier type de particules d'argent comprend des particules d'argent oblongues. L'adhésif thermiquement conducteur comprend en outre un liant, et facultativement un solvant.

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