Method for removing organic film

Details Method for removing organic film Method for removing organic film

H - Electricity

01

L

H01L 21/027 (2006.01)

Patent

CA 2070839

A method of removing organic coating which is vary effective in removing photoresist films in a process of manufacturing semiconductor devices. The organic film is removed by treating a substrate (32) on which a photoresist film (31) is formed in a wet-type processing vessel (34) which is filled with a processing liquid such as a mixture of sulfuric acid and hydrogen peroxide water, or in an ozone processing vessel (34) fillers with a liquid obtained by adding ozone or ozone water to ultra-pure water after the dry processing of the substrate with ozone or oxygen plasma.

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