H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 49/00 (2006.01) G01J 5/20 (2006.01) H01L 27/146 (2006.01) H01L 31/09 (2006.01) H01L 31/18 (2006.01)
Patent
CA 2275863
The microbridge structure comprises a substrate layer provided with two first electrical contacts; a microstructure including a sensing area provided with two second electrical contacts; and a micro support for suspending the microstructure over and at a predetermined distance from the substrate layer. The micro support has two electrically conductive paths made of electrically conductive layers. The two electrically conductive paths connect respectively the two first electrical contacts of the substrate layer to the two second electrical contacts of the microstructure. The micro support extends generally underneath the microstructure, between the microstructure and the substrate layer. The invention also relates to a method for forming the microbridge structure.
Institut National D'optique
Robic
LandOfFree
Microbridge structure and a method for forming the... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microbridge structure and a method for forming the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microbridge structure and a method for forming the... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1375319