Methods and apparatuses for material deposition

C - Chemistry – Metallurgy – 23 – C

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C23C 8/60 (2006.01) B01J 19/10 (2006.01) B05D 1/12 (2006.01) C23C 10/28 (2006.01) C23C 24/08 (2006.01)

Patent

CA 2607550

An apparatus and method are described for deposition of materials such as particulate materials onto a surface. The methods employ the use of shockwaves or compression waves to project the particulate material onto the surface as desired. This allows for the preparation of solid objects or coated surfaces that exhibit, for example, superior density and uniformity.

L'invention concerne un appareil et un procédé permettant le dépôt de matériaux tels que des matériaux en particules sur une surface. Ces procédés consistent à utiliser des ondes de choc ou des ondes de compression pour projeter sélectivement le matériau en particules sur la surface. Ce procédé permet de préparer des objets pleins ou des surfaces revêtues présentant par exemple une densité et une uniformité améliorées.

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