C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 24/04 (2006.01) C23C 4/08 (2006.01) C23C 24/08 (2006.01) F02K 9/52 (2006.01) F02K 9/60 (2006.01)
Patent
CA 2444917
A process is provided for forming a deposit layer on a substrate, in particular forming a copper or copper alloy deposit layer on at least one of an inner surface and/or an outer surface of a metal alloy manifold used in a rocket engine. The process comprises the steps of providing metal powder particles having a size in the range of from a size sufficient to avoid getting swept away from the substrate due to a bow shock layer to up to 50 microns and forming a deposit layer on at least one surface of the substrate by passing the metal powder particles through a spray nozzle at a speed sufficient to plastically deform the metal powder particles on the at least one surface.
Haynes Jeffrey D.
Jeganathan Karthikeyan
Ogilvy Renault Llp/s.e.n.c.r.l.,s.r.l.
United Technologies Corporation
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