Compound flooring and manufacturing method

Details Compound flooring and manufacturing method Compound flooring and manufacturing method

E - Fixed Constructions

04

F

E04F 15/02 (2006.01) B32B 21/08 (2006.01) B32B 37/04 (2006.01) E04F 15/10 (2006.01)

Patent

CA 2628690

The present invention relates to a compound flooring material. The compound flooring such as thermoplastic/wood compound flooring is produced by adhering two layers through adhesive cementing. According to an embodiment, a first sheet is a high quality wood veneer and the second sheet is a low foaming, environment friendly, UPVC board. The sheets are bonded by incorporating a high quality polyvinyl acetate polymer adhesive that contains no formaldehyde, thus providing a strong, safe, odorless product. The UPVC/wood compound flooring has a very low shrinking and swelling rate and is convenient and accurate to install.

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