C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 3/38 (2006.01) C23C 16/00 (2006.01) C25D 7/12 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2465363
Disclosed are copper electroplating solutions, methods for using the solutions and products formed by using such methods and solutions in which the solutions contain copper alkanesulfonate salts and free alkanesulfonic acids, wherein the free acid has a concentration from about 0.05 to about 2.50 M, and which are intended for the metallization of micron-sized dimensioned trenches or vias, through-holes and microvias.
L'invention concerne des solutions de cuivrage électrolytique, des procédés permettant d'utiliser ces solutions et des produits formés à l'aide de ces procédés et de ces solutions. Ces solutions contiennent des alcanesulfonates de cuivre et des acides alcanesulfoniques libres, l'acide libre ayant une concentration comprise entre 0,05 et 2,50 M environ. Ces solutions sont destinées à la métallisation de tranchées ou de trous d'interconnexion, de trous débouchants ou de microtrous d'interconnexion de l'ordre du micron.
Atofina Chemicals Inc.
Borden Ladner Gervais Llp
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