Telephone wiring interconnect apparatus and method

H - Electricity – 01 – R

Patent

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Details

H01R 24/58 (2011.01) H04M 7/00 (2006.01) H04Q 1/18 (2006.01)

Patent

CA 2367624

An interconnect apparatus for electrically connecting Telco wires to subscriber wires is arranged and configured to withstand overcurrent and overvoltage conditions. The interconnect apparatus includes a jack, a first set of contacts, and a first set of by-pass conductors. The first set of by-pass conductors is electrically connected to the first set of contacts and has a greater current carrying capacity than the first set of contacts. The interconnect apparatus further includes a second set of by-pass conductors and a plug. The second set of by-pass conductors is electrically connected to the first set of by-pass conductors when the plug and jack are engaged. The second set of by-pass conductors may also have a greater current carrying capacity than the first set of contacts. Preferably, the first set of by-pass conductors is spaced sufficiently apart and the second set of by-pass conductors is spaced sufficiently apart to substantially eliminate arcing.

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