An automated singularization tool for brittle insulating arrays

Details An automated singularization tool for brittle insulating arrays An automated singularization tool for brittle insulating arrays

H - Electricity

01

L

H01L 21/78 (2006.01) H01L 21/68 (2006.01)

Patent

CA 2490849

This invention generally relates to a method and an apparatus for subdividing a sheet of brittle insulating material provided with a plurality of semiconductor chips electrically bonded to respective underlying circuit blocks printed on the sheet to provide each chip with its own substrate. The chips are arranged in rows and columns separated one from the other by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the scribed chip carrying sheet in a flexible conformable nest having a solid bottom and a top having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet; positioning a rigid convex, arched anvil parallel to the scribe lines in the row kerfs, pneumatically forcing the sheet containing nest to conform to the arch of the anvil and thereby fracture the sheet along the scribe lines in the row kerfs lying parallel to the arch; removing the pneumatic force, rotating the anvil ninety degrees to parallel the scribe lines in the column kerfs, pneumatically forcing the conformable nest against the rotated anvil to fracture the sheet along the scribe lines in the column kerfs, removing the pneumatic force, removing the nest from the apparatus and removing the individualized chip bearing substrates from the nest.

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