H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/60 (2006.01) H01L 31/02 (2006.01) H01L 31/0203 (2006.01)
Patent
CA 2261838
A novel technique of easily and inexpensively mounting an optical converter and semiconductor devices on a printed wiring board at a high density. Before an encapsulated body is mounted on a printed wiring board (400), an opening (340) is made in the board, and conductive bonding portions (360b) are provided on the base member (100). The body is bonded face-down. At least part of the body is fitted in the opening (340), and therefore the height of the body from the surface of the board is small, permitting the face-down bonding.
Cette invention concerne un nouveau procédé permettant de monter aisément et à moindre coût un convertisseur optique et des dispositifs semi-conducteurs sur une carte imprimée avec une densité élevée. Avant de monter un corps encapsulé sur une carte imprimée (400), on pratique une ouverture (340) sur la carte, et l'on munit l'élément de base (100) de zones de liaison conductrices (360b). On soude ledit corps en position retournée. Une partie au moins de ce corps s'adapte à l'ouverture (340) et de ce fait, la hauteur du corps en saillie par rapport à la surface de la carte est faible, ce qui rend possible le soudage après retournement dudit corps.
Borden Ladner Gervais Llp
Seiko Epson Corporation
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