H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 21/68 (2006.01) H01L 23/538 (2006.01) H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01) H05K 3/32 (2006.01) H05K 3/40 (2006.01)
Patent
CA 2074648
A polyimide multilayer wiring substrate that comprises a plurality of wiring layer blocks, each of which including a plurality of polyimide wiring layers, which are electrically connected and formed into a single body by means of an anisotropic conductive film that is inserted between adjacent blocks, the multiple wiring substrate being manufactured by inserting said anisotropic conductive film between adjacent blocks and compressing and heating the blocks and layer of film so as to form them into a single body. This process of inserting, compressing and heating is repeated N times to provide a layered structure comprising N pieces of wiring layer blocks.
Cette invention concerne un support de câblage multicouche en résine polyimide qui comprend une série de blocs de câblage formés chacun de plusieurs couches de résine polyimide interconnectées électriquement et réunis en un ensemble monobloc au moyen d'une pellicule conductrice anisotrope intercalée entre eux. Le support de câblage multicouche objet de l'invention est réalisé en intercalant ladite pellicule conductrice anisotrope entre blocs adjacents et en comprimant et chauffant le tout pour former un ensemble monobloc. Le procédé d'insertion, compression et chauffage est répété N fois pour produire un support multicouche formé de N blocs de câblage.
Corporation Nec
G. Ronald Bell & Associates
LandOfFree
Polyimide multilayer wiring substrate and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polyimide multilayer wiring substrate and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polyimide multilayer wiring substrate and method for... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1410329