Process for the production of three-dimensional objects by...

B - Operations – Transporting – 29 – C

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B29C 67/00 (2006.01) B29C 67/04 (2006.01)

Patent

CA 2560181

The invention relates to a method and device for joining material in order to produce three-dimensional objects (7) by means of selective heating effected by a laser (5) having a wavelength ranging from 100 to 3,000 nm. To this end, the beam spot can be focussed or unfocussed or even two-dimensional like when using a diode laser during which the bars can be arranged in stacks. The selectivity of the melting on is achieved by applying an absorber to specified partial areas of a layer made of a powdery substrate (8), and by subsequently heating the absorber by means of laser radiation having a wavelength ranging from 100 to 3,000 nm. The heated absorber releases the energy present inside to its powdery substrate surrounding it whereby the substrate is melted on and, after cooling, they are tightly joined to one another. The method is distinctly more versatile, more economical and faster than conventional laser sintering.

L'invention concerne un procédé et un dispositif pour combiner des matériaux afin de produire des objets tridimensionnels (7), par chauffage sélectif, au moyen d'un laser (5) dont la longueur d'onde est comprise entre 100 et 3000 nm. Le point du faisceau peut être focalisé ou non, ou peut même être plan comme celui d'un laser à diode dans lequel les barres peuvent être empilées. La fusion peut se faire de manière sélective, par application d'un absorbeur sur des zones partielles spécifiques d'une couche de substrat pulvérulent (8), puis chauffage de l'absorbeur au moyen d'un rayonnement laser à une longueur d'onde comprise entre 100 et 3000 nm. L'absorbeur chauffé transfère l'énergie qu'il contient au substrat pulvérulent situé autour, ce qui fait fondre ledit substrat, l'absorbeur et le substrat étant solidement liés l'un à l'autre après le processus de refroidissement. Le procédé selon l'invention offre beaucoup plus de souplesse et est nettement plus économique et rapide que les procédés de frittage laser traditionnels.

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