C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
117/114, 117/158
C04B 41/90 (2006.01) C04B 41/88 (2006.01) C23C 30/00 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/24 (2006.01) H05K 1/03 (2006.01)
Patent
CA 2031459
A surface structure of a ceramic substrate is capable of suppressing diffusion of Ni to an uppermost Au plating layer. Furthermore, the thickness of the Au plating layer is reduced in accordance with the present invention. In the method of manufacturing the surface structure, a metallized layer, an Ni layer and an Au layer are formed in this order on the surface of a ceramic substrate. The substrate is heated in a non-oxidizing atmosphere to cause an alloying reaction between the Ni layer and the Au layer. Thereafter, the uppermost plating layer is formed on the resulting NiAu alloy layer. Since Ni in the NiAu alloy layer is not easily released, diffusion of Ni into the Au plating layer can be suppressed sufficiently. Therefore, the Au plating layer can be significantly reduced in thickness.
Sasame Akira
Yamakawa Akira
G. Ronald Bell & Associates
Sumitomo Electric Industries Ltd.
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