H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/42 (2006.01)
Patent
CA 2137823
A method is provided for making a plate through hole printed circuit board. The method includes the first step of forming conductive circuit elements on two opposed faces of a non-conductive substrate. The substrate and circuit elements are coated with a de-sensitising material, the de-sensitising material comprising an alkali- strippable material. Holes are formed through the substrate, each hole passing through a circuit element on each of the opposed faces of the board. The board is treated to render the substrate which is exposed in the holes receptive to the action of a metallic plating solution. The de-sensitizing material is removed by treating the board with an alkaline accelerator solution to accelerate the action of the sensitisation and simultaneously to remove the de-sensitising material. The board is finally treated with an electroless metallic plating solution to deposit conductive metal in the holes to a desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements.
Borden Ladner Gervais Llp
Knopp John Frederick David
Macdermid Incorporated
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