Integrated circuit connection using an electrically...

Details Integrated circuit connection using an electrically... Integrated circuit connection using an electrically...

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 23/49 (2006.01) H01L 23/498 (2006.01) H05K 3/30 (2006.01) H05K 3/32 (2006.01) H05K 3/36 (2006.01)

Patent

CA 2322468

A method and apparatus is provided for electrically and mechanically interconnecting electronic circuit assemblies or electronic modules. An integrated circuit (300) includes a plurality of leads (302) extending from a surface (305), each of the leads (302) having a seating portion (403) and a stem portion (402). A printed circuit board (400) includes a plurality of plated through holes (401) therein corresponding to the plurality of leads (302) extending from the integrated circuit (300). The steps of the method include positioning the printed circuit board (400) so that a lower surface (404) of the printed circuit board (400) rest on the seating portion (403) of the leads (302) of the integrated circuit (300), and so that the stem portion (302) of each of the leads are positioned within the corresponding plated through holes (401) in the printed circuit board (400). An electrically conductive epoxy adhesive (602) is then dispensed into the holes (401) having the leads (302) therein, and cured to form a solid, electrical, and mechanical connection between the printed circuit board (400) and integrated circuit (300).

L'invention concerne un procédé et un appareil d'interconnexion électrique et mécanique d'ensembles de circuits électroniques ou de modules électroniques. Un circuit intégré (300) comprend plusieurs sorties (302) s'étendant à partir d'une surface (305), chaque sortie (302) comportant une partie d'appui (403) et une partie de pied (402). Une carte à circuit imprimé (400) comprend plusieurs trous de passage métallisés (401) correspondant aux multiples sorties (302) s'étendant à partir du circuit intégré (300). Les phases du procédé consistent à disposer la carte à circuit imprimé (400) de sorte qu'une surface inférieure (404) de la carte à circuit imprimé (400) repose sur la partie d'appui (403) des sorties du circuit intégré (300) et de sorte que la partie de pied (402) de chaque sortie soit disposée à l'intérieur du trou de passage métallisé (401) correspondant dans la carte à circuit imprimé (400). Un adhésif époxyde conducteur (602) est alors introduit dans les trous (401) contenant les sorties (302) et soumis à un durcissement pour former une connexion solide, électrique et mécanique entre la carte à circuit imprimé (400) et le circuit intégré (300).

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