Aqueous resin dispersions

Details Aqueous resin dispersions Aqueous resin dispersions

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08L 77/00 (2006.01) C09D 163/00 (2006.01)

Patent

CA 2084340

Abstract of the Disclosure An aqueous resin dispersion containing as an aqueous resin component a polyamide-modified epoxy-poly- amine resin comprising a reaction product of a phenollic hydroxyl group-terminated polyamide compound obtained by the reaction of a polyamine compound containing at least two primary and/or secondary amino groups in a molecule and having a number average molecular weight of 40 to 8,000, a polycarboxylic acid having a number average molecular weight of 100 to 8,000 and a compound contain- ing at least one phenolic hydroxyl group and one carboxyl group in a molecule, a bisphenol compound and a bisphenol diglycidyl ether compound, and an active hydrogen-con- taining amine compound. Said aqueous resin dispersion is excellent in corrosion resistance and especially suited for use in cathode electrodeposition coating.

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