Process and apparatus for the treatment of semiconductor...

Details Process and apparatus for the treatment of semiconductor... Process and apparatus for the treatment of semiconductor...

Category

H - Electricity

Subcategory

01

Subsubcategory

L

IPC codes

H01L 21/306 (2006.01) B08B 3/08 (2006.01) B08B 3/12 (2006.01) H01L 21/00 (2006.01)

Type

Patent

Patent number

CA 2167283

Description

Provided is a process for removing organic materials from semiconductor wafers. The process involves the use of subambient deionized water with ozone absorbed into the water. The ozonated water flows over the wafers and the ozone oxidizes the organic materials from the wafers to insoluble gases. The ozonated water may be prepared in-situ by diffusing ozone into a tank containing wafers and subambient deionized water. Also provided is a tank for the treatment of semiconductor wafers with a fluid and a gas diffuser for diffusion of gases directly into fluids in a wafer treatment tank.

L'invention concerne un procédé servant à enlever des matières organiques de plaquettes en semi-conducteur. Ce procédé comprend l'utilisation d'eau désionisée au-dessous de la température ambiante dans laquelle est absorbée de l'ozone. L'eau ozonisée s'écoule au-dessus des plaquettes et l'ozone oxyde les matières organiques des plaquettes, afin de les transformer en gaz insolubles. L'eau ozonisée peut se préparer sur place par diffusion d'ozone à l'intérieur d'un réservoir contenant des plaquettes et de l'eau désionisée au-dessous de la température ambiante. L'invention concerne également un réservoir (13) de traitement de plaquettes en semi-conducteur (14) avec un fluide, ainsi qu'un diffuseur de gaz (4) servant à diffuser directement des gaz dans les fluides d'un réservoir (13) de traitement de plaquettes.

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