C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 51/06 (2006.01) B32B 27/08 (2006.01) C08J 5/12 (2006.01) C09J 151/06 (2006.01)
Patent
CA 2003389
2 6 ABSTRACT OF THE DISCLOSURE The present invention relates to a polypropylene resin composition useful as an adhesive comprising (A) from about 51 wt. % to about 99 wt. % of a modified polypropylene resin graft-modified with a radical-polymerizable polar unsaturated compound or a mixture of the modified polypropylene resin graft-modified with a radical polymerizable polar unsaturated compound with an unmodified polypropylene resin, (B) a substantially non-crystalline .alpha.-olefin copolymer, and (C) an ethylene/ .alpha.-olefin copolymer having a density of from about 0.860 g/cm3 to less than about 0.910 g/cm3, a n-hexane insolubility of at least about 50 wt. % and a melting point of at least 100°C, wherein the combined weights of components (B) and (C) is from about 1 wt.%. to about 49 wt. %, and the weight ratio of (B)/(C) is from about 1/99 to about 99/1. The resin composition is particularly suitable for bonding a polypropylene resin layer and an ethylene/vinyl alcohol copolymer layer, and a polypropylene resin layer and a nylon layer.
Abe Masaru
Kawai Yoichi
Miyazaki Takashi
Kirby Eades Gale Baker
Mitsui Toatsu Chemicals Inc.
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