Liquid cure promoter compositions with suppressed solids...

C - Chemistry – Metallurgy – 08 – K

Patent

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C08K 5/00 (2006.01) C08F 283/00 (2006.01) C08L 33/00 (2006.01)

Patent

CA 2624430

This invention provides a cure promoter composition with suppressed solids forming tendencies. The composition is formed from components which prior to use in forming the composition are comprised of: a) N-methyl-N-(2- hydroxyethyl)-p-toluidine or N,N-bis(2-hydroxyethyl)-p-toluidine, or both; and b) at least one liquid monomelic ester of acrylic acid and/or at least one liquid monomeric ester of methacrylic acid; a) and b) being proportioned such that the a):b) weight ratio is in the range of about 50:50 to about 99:1.

La présente invention concerne une composition liquide de promoteur de polymérisation avec tendances à la formation de solides supprimées. Cette composition est formée à partir de composants qui, avant une utilisation dans la formation de cette composition sont constitués: (a) d'une quantité principale de N-méthyl-N-(2-hydroxyéthyl)-p-toluidine ou de N,N-bis(2- hydroxyéthyl)-p-toluidine ou des deux, et (b) d'au moins un ester monomélique liquide d'acide acrylique et/ou d'au moins un ester monomère d'acide méthacrylique, (a) et (b) étant proportionnés de sorte que le rapport de masse (a)/(b) soit compris entre environ 50/50 et environ 99/1.

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