Laser excisional new attachment procedure

Details Laser excisional new attachment procedure Laser excisional new attachment procedure

A - Human Necessities

61

C

A61C 3/00 (2006.01)

Patent

CA 2288659

A method for removing deep gingival pockets (20) provides for excise of disease while providing for reconnection of the tissue-tooth connection. Steps in the process include creating a gingival through in the pocket (20) with a contact laser fiber, excising the pocket epithelium (60) while selectively removing sulcular (10B) and pocket epithelium (60) and granulation tissue fully around the targeted tooth (10) to the full depth without breaking through the mucogingival junction (50), scaling the root surfaces to the full depth ultrasonically, lasing the pocket (20) to remove granulation tissue and to disinfect the tissue, assist in hemostatis, cauterize free nerve endings, seal lymphatics, prepare the tissue for welding and desensitize the tooth (10), and compressing the gingival tissue (5) against the tooth surface (10A) until adhesion is achieved.

L'invention concerne une méthode permettant d'enlever des poches gingivales profondes (20) et d'éliminer les parties pathologiques tout en rétablissant la liaison entre le tissu et la dent. Selon la méthode, on crée un sillon gingival dans la poche (20) au moyen d'une fibre de laser à contacts; on excise l'épithélium (60) de la poche tout en enlevant sélectivement l'épithélium du sillon (10B), l'épithélium de la poche (60) et le tissu de granulation tout autour de la dent cible (10) sur toute la profondeur, sans interrompre la jonction mucogingivale (50); on détartre par ultrasons la surface de la racine sur toute la profondeur; on applique le rayonnement laser sur la poche (20) de façon à enlever le tissu de granulation, à désinfecter le tissu gingival, à favoriser l'hémostase, à cautériser les terminaisons nerveuses libres, à obturer les lymphatiques, à préparer le tissu en vue de la soudure et à désensibiliser la dent (10); et on comprime le tissu gingival (5) contre la surface (10A) de la dent jusqu'à ce que l'adhésion soit réalisée.

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