Photoimageable, dielectric crosslinkable copolyesters

Details Photoimageable, dielectric crosslinkable copolyesters Photoimageable, dielectric crosslinkable copolyesters

C - Chemistry, Metallurgy

07

C

C07C 69/90 (2006.01) C07C 69/94 (2006.01) C08L 67/00 (2006.01) G03F 7/004 (2006.01) G03F 7/027 (2006.01) H01L 21/762 (2006.01) H01L 23/498 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2198786

Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.

L'invention est constituée par des films de copolyester réticulables diélectriques photosensibles utilisés comme films diélectriques et comme films de résine photosensible dans les circuits micro-électroniques, qui peuvent également être utilisés dans la production des boîtiers MCM-L. Dans diverses concrétisations de l'invention, on obtient des composés de formation de films de copolyester réticulables diélectriques photosensibles à appliquer à des surfaces de substrat de micro-électronique, un oligomère photosensible pour produire les copolyesters réticulables et des boîtiers MCM-L produits avec les copolyesters réticulés.

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