Electronic module of extra-thin construction

Details Electronic module of extra-thin construction Electronic module of extra-thin construction

H - Electricity

05

K

H05K 1/18 (2006.01) G06K 19/077 (2006.01) H01L 23/495 (2006.01) H01L 23/498 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2109761

In the electronic module (M) of extra-thin construction disclosed, it is the principal object to substantially reduce the tendency to fracture of the module's semiconductor chip (1) embedded in the plastic casing (10) of the module (M), notwith-standing the extremely small thickness of the casing. The chip is fitted on the chip pad (22) of a system support (20) formed by a thin metal strip, commonly known as a lead frame. The chip (1) may partly overlap the external contacts (21) of the module that lie on one of the flat sides of the module's plastic casing (10). Slits (23) in the system support, which form the boundaries of the chip pad (22) and are inevitable lines of weakness in the thin metal strip, are situated at an oblique angle relative to the edges of the square or rectangular chip (1), preferably at about 45°; hence the slits extend also at an oblique angle to possible fracture lines within the monocrystalline structure of the material used in chip manufacture, because said fracture lines are parallel to the chip's edges. Other slits (24) in the metal strip, which extend from said boundary slits (23), should preferably also be at an angle relative to the edges of the chip. Further characteristics disclosed relate to the mechanical bond between parts of the system support (20) and the module casing (10), and the bonding of the entire module (M) to the surrounding plastic material when it is moulded into a supporting body or medium, for example in the manufacture of chip cards.

Affiliated with

Also associated with

Rating

Electronic module of extra-thin construction does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic module of extra-thin construction, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic module of extra-thin construction will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1448056