Methods for using a support backer board system for siding

Details Methods for using a support backer board system for siding Methods for using a support backer board system for siding

B - Operations, Transporting

29

C

B29C 47/08 (2006.01) B29C 47/06 (2006.01) B29C 51/00 (2006.01) B29C 51/10 (2006.01) B29C 51/14 (2006.01) E04F 13/08 (2006.01) E04F 13/18 (2006.01)

Patent

CA 2299872

A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.

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