Circuit structure having a flip-mounted matrix of devices

Details Circuit structure having a flip-mounted matrix of devices Circuit structure having a flip-mounted matrix of devices

H - Electricity

01

L

H01L 23/50 (2006.01) H01L 23/52 (2006.01)

Patent

CA 2236999

A means of connecting a plurality of essentially identical active devices (Q1, Q2, Q3, Q4) is presented for the purpose of multifunction and multiple function operation. These devices (Q1, Q2, Q3, Q4), mounted on a chip (66), are flip-mounted to a circuit motherboard having large passive elements. A push-pull amplifier (50) is presented as an example in which the multiple function operation is the combining of amplifiers (56, 58) whose active devices (Q1, Q2, Q3, Q4) are on a single chip (66). The electromagnetic coupling, impedance matching and signal transmission are variously provided by the use of striplines (82, 88), slotlines (94, 100), coplanar waveguides (116, 130), and a slotline (180) converted into a coplanar waveguide (176, 178).

Procédé de connexion d'une pluralité de dispositifs actifs très sensiblement identiques (Q¿1?, Q¿2?, Q¿3?, Q¿4?) permettant d'assurer le fonctionnement multifonction et de fonctions multiples. Les dispositifs (Q¿1?, Q¿2?, ¿3?, Q¿4?) montés sur une puce (66) sont montés sans soudure de fils sur une carte mère de circuit comprenant de gros éléments passifs. Un amplificateur push-pull (50) est présenté à titre d'exemple pour illustrer le fait que la mise en oeuvre des fonctions multiples résulte de la combinaison d'amplificateurs (56, 58) dont les dispositifs actifs (Q¿1?, Q¿2?, Q¿3?, Q¿4?) sont situés sur une seule puce (66). Le couplage électromagnétique, l'adaptation d'impédance et la transmission du signal s'effectuent de manière variable au moyen de lignes microruban (82, 88), de lignes microfentes (94, 100), de guides d'ondes coplanaires (116, 130) et d'une ligne microfente (180) transformée en guide d'ondes coplanaire (176, 178).

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