Receiving device

Details Receiving device Receiving device

H - Electricity

04

B

H04B 1/18 (2006.01) H01Q 1/24 (2006.01) H01Q 21/00 (2006.01) H01Q 21/06 (2006.01)

Patent

CA 2076295

Abstract of the Disclosure A plane antenna 2 and a receiving circuit 5 are formed on one and the same semiconductor substrate 1. Both can be connected by a microstrip line 7, and so on. Resultantly the receiving device as a whole can be small-sized and light. Furthermore, the plane antenna, the receiving circuit, and the microstrip line can be integrated by the common IC process, and the fabrication cost can be drastically reduced.

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