Photo-semiconductor module

Details Photo-semiconductor module Photo-semiconductor module

H - Electricity

01

L

345/16, 345/62

H01L 27/14 (2006.01) G02B 6/42 (2006.01) H01L 31/0203 (2006.01) H01L 31/0232 (2006.01)

Patent

CA 2019074

Abstract of the Disclosure A photo-semiconductor module is disclosed wherein a reliable airtight condition can be obtained and an operability in assembly can be improved. The photo-semiconductor module comprises a substrate carried in a casing, a photo-semiconductor chip mounted on the substrate, and a support member carried on the substrate and having an inclined face which is inclined by an angle of 45 degrees with respect to a surface of the substrate. A semi-spherical lens is securely mounted on the inclined face of the support member, and an opening formed in a side wall of the casing is sealed airtight by a glass member while an upper portion of the casing is sealed airtight by a lid. When an optical fiber is mounted onto the casing such that an end face thereof may be located in the opening in the side wall of the casing, the optical fiber and the photo-semiconductor chip are optically coupled to each other by way of the semi-spherical lens.

Affiliated with

Also associated with

Rating

Photo-semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photo-semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photo-semiconductor module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1468413