Thermoplastic film, reinforced hollow glass microsphere...

B - Operations – Transporting – 32 – B

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B32B 15/08 (2006.01) B32B 5/22 (2006.01) B32B 27/06 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2055982

The present invention is directed to a metal-clad electrical laminate which comprises a core of one or more of a polyetherimide thermoplastic, polyphenylene oxide thermoplastic, or a resinous-filled reinforced substrate. A pair of intermediate layers of hollow glass microsphere-filled polyphenylene oxide/epoxy is bound to either side of the core. Finally, a pair of metal foil layers are bound to the filled intermediate layers to produce the laminate of the present invention. The laminate desirably has a thickness of less than about 0.010 in., a dielectric constant of about 3 or less, and a HGM content in excess of about 10 wt-%. Additionally, the laminate has a softening point sufficiently high to avoid substantial distortion at processing temperatures of around 200À- 235ÀC.

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