Thermoplastic molding materials based on polyamide mixtures

Details Thermoplastic molding materials based on polyamide mixtures Thermoplastic molding materials based on polyamide mixtures

C - Chemistry, Metallurgy

08

L

C08L 77/06 (2006.01) C08L 77/00 (2006.01)

Patent

CA 2078624

- 28 - O.Z. 0050/42685 Abstract of the Disclosure: Thermoplastic molding materials comprise A) from 1 to 18% by weight of a partly aromatic copoly- mer having a triamine content of below 0.5% by weight and composed of A1) from 20 to 90% by weight of units derived from terephthalic acid and hexamethylenediamine, A2) from 0 to 50% by weight of units derived from ?-caprolactam, A3) from 0 to 80% by weight of units derived from adipic acid and hexamethylenediamine, and A4) from 0 to 40% by weight of further polyamide- forming monomers, the proportion of component (A2) or (A3) or (A4) or of a mixture thereof being at least 10% by weight, B) from 22 to 99% by weight of a partly crystalline- polyamide other than A), C) from 0 to 60% by weight of fibrous or particulate fillers or mixtures thereof, and D) from 0 to 40% by weight of an elastomeric polymer.

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