Patch package structure

Details Patch package structure Patch package structure

B - Operations, Transporting

65

D

B65D 75/36 (2006.01) A61M 37/00 (2006.01)

Patent

CA 2651544

The present invention provides a patch package structure which includes a package and a patch disposed in the package, in which the package includes a first sheet material which is substantially planar and a second sheet material which has been molded, the second sheet material has a first region which projects outward from the package and a second region which surrounds the first region and is substantially planar, the first region has a planar outer shape which includes a planar outer shape of the patch, and the second region has a first sealed region which surrounds the first region and an unsealed region located nearer to a central part of the second sheet material than the first sealed region. According to the invention, the patch is inhibited from adhering to the inner surface of the package and the package can be easily opened by hand.

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