Electronic chip connection assembly and method

Details Electronic chip connection assembly and method Electronic chip connection assembly and method

H - Electricity

05

K

356/9

H05K 1/02 (2006.01)

Patent

CA 2002315

AN ELECTRONIC CHIP CONNECTION ASSEMBLY AND METHOD ABSTRACT OF THE DISCLOSURE This assembly allows connecting in one operation a plurality of chips to chips and to a substrate or each chip to a substrate using an elastomeric pressure means that continues to pressure chips connecting micron sized leads to chip pads on one end and to circuitry on a substrate on the other end; a metallic cover fastening to the substrate and containing said electronic pressure means also includes a ribbed projection to hermetically seal the unit so that the substrate itself becomes an integral part of the assembly package.

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