Passive cooling for fiber to the premise (fttp) electronics

H - Electricity – 05 – K

Patent

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Details

H05K 7/20 (2006.01) G02B 6/00 (2006.01) H04B 10/02 (2006.01)

Patent

CA 2563616

A phase change material, including multiple phase change materials of different formulations, is placed in heat transfer association with an electronics enclosure (e.g., a sealed enclosure) deployed in an environment that causes the electronics and the phase change material to experience periods of heating and periods of cooling. During the periods of heating, the phase change material absorbs heat and changes at least partially from a first state to a second state to maintain the temperature of the electronics at a desirable level. During the periods of cooling, the phase change material reverts at least partially back to the first state for future heat absorption. The phase change material is cooled by a thermally cooler body such as the night sky. The electronics enclosure and phase change material may be placed in a second enclosure covered with a paint having a paint additive that reflects solar radiation.

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