Method and device for bonding a wire conductor

Details Method and device for bonding a wire conductor Method and device for bonding a wire conductor

G - Physics

06

K

G06K 19/077 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2245775

Process and device for the contacting of a wire conductor (113) in the course of the manufacture of a transponder unit arranged on a substrate (111) and comprising a wire coil (112) and a chip unit (115), wherein in a first phase the wire conductor (113) is guided away via the terminal area (118, 119) or a region accepting the terminal area and is fixed on the substrate (111) relative to the terminal area (118, 119) or the region assigned to the terminal area, and in a second phase the connection of the wire conductor (113) to the terminal area (118,119) is effected by means of a connecting instrument (125).

L'invention concerne un procédé et un dispositif pour la connexion d'un conducteur électrique (13) lors de la fabrication d'un ensemble répondeur disposé sur un substrat (11) et comportant un bobinage (12) et une puce (15). Dans une première phase, le conducteur électrique (13) s'étend sur la plage de connexion (18, 19) ou une région recevant cette plage de connexion, et est fixé sur le substrat (11) par rapport à la plage de connexion (18, 19) ou la région associée à cette dernière, et dans une deuxième phase, le conducteur électrique (13) est raccordé à la plage de connexion (18, 19) au moyen d'un système de raccordement (25, 37).

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