Semiconductor chip module and method for manufacturing the same

Details Semiconductor chip module and method for manufacturing the same Semiconductor chip module and method for manufacturing the same

H - Electricity

01

L

H01L 23/40 (2006.01) H01L 23/32 (2006.01) H01L 23/367 (2006.01) H01L 23/433 (2006.01)

Patent

CA 2075593

Abstract of the Disclosure The semiconductor chip module according to the present invention comprises a semiconductor substrate on which a wiring portion is formed, a semiconductor chip 4 mounted so as to face a circuit side up to the wiring portion, a heat sink 3, 3a, 13 with one end thereof contacted to the central portion of an upper surface of the semiconductor chip 4, 4a; and a cap 2 which has an opening 2a for exposing the other end of the heat sink 3, 3a, 13 to the outside thereof, the cap 2 enclosing all of the semiconductor chips 4, 4a. Accordingly, the heat generated from the semiconductor chips 4, 4a can be dissipated through the heat sink 3, 3a, 13 to the outside. It results in providing a semiconductor chip module without inconvenience for operation with high speed.

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