Hot-melt silicone pressure sensitive adhesive with...

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 183/04 (2006.01) A61K 9/70 (2006.01) C09J 11/08 (2006.01) C09J 171/02 (2006.01) C09J 183/10 (2006.01)

Patent

CA 2139992

The instant invention pertains to a hot-melt pressure sensitive adhesive composition wherein the composition is comprised of (A) a silicone pressure sensitive adhesive selected from a mixture of (i) a silicone resin and (ii) a silicone fluid or a condensed product of (i) and (ii); the silicone pressure sensitive adhesive exhibiting tackiness and adhesiveness; and (B) from 1 to 20 weight percent, based on the total weight of (i) and (ii), of a siloxylated polyether wax. The instant invention also encompasses method of using the composition, methods of making hot-melt silicone pressure sensitive adhesive-coated substrates and devices made using the composition.

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