Semiconductor mounting package

Details Semiconductor mounting package Semiconductor mounting package

H - Electricity

01

L

H01L 23/06 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2284396

A semiconductor mounting package includes one or a plurality of diamond members having one surface on which one or a plurality of semiconductor chips are mounted and the other surface opposing to this one surface, and a high thermal conductivity metal member adhered to the other surface of the diamond member.

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